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Silicon Box cutting-edge, advanced panel-level packaging foundry announces $3.6B investment for expansion into Italy




Investment in Northern Italy (Nord Italia), will bring first-of-its-kind, end-to-end chiplet based semiconductor system integration to Europe

  • Investment of up to $3.6B (€3.2B) will create approximately 1,600 semiconductor jobs at Silicon Box’s new manufacturing facility, and create thousands of indirect supplier and contract construction jobs
  • New Italian facility will enable next generation applications in artificial intelligence (AI), high performance computing (HPC), large language models (LLM), electric vehicles (EV) and automotive, wearables, mobile, smart consumer, edge computing and more by providing advanced packaging and test capacity, anticipated to be in demand in the coming years
  • Facilities will be constructed according to green building principles and will operate with high environmental standards to minimize carbon footprint and environmental impact. Silicon Box’s solutions allow greater sustainability through better thermal and electrical performance
  • Silicon Box’s investment will align with the Italian government and the European Commission and Union’s goal of a more resilient semiconductor supply chain and to drive innovation

ROME, March 12, 2024 /PRNewswire/ — Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box’s flagship foundry in Singapore which has proven capability and capacity for the world’s most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

As well as bringing the most advanced chiplet integration, packaging, and testing to Italy, Silicon Box’s manufacturing process is based on panel-level-production; a world leading, first-of-its-kind combination that is already shipping product to customers from its Singapore foundry. Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally.  The new integrated production facility is expected to serve as a catalyst for broader ecosystem investments and innovation in Italy, as well as the rest of the European Union.

“We believe innovation is driven by cultural values that embrace curiosity, passion, and a tireless commitment to excellence,” said Dr. Byung Joon (BJ) Han, co-founder and CEO of Silicon Box. “Italy was one of our top choices for global expansion because we found that its culture shares our values. We have seen great promise through our collaborations with the Italian government and various regional, institutional and commercial stakeholders to date, which we know will be necessary to successfully execute this first-of-a-kind project in Europe.”

“We are excited to bring Italy to the forefront of chiplet deployment and the semiconductor industry, through this investment into the world’s most advanced packaging solution. It will enhance competitive strengths in design, artificial intelligence (AI), large language models (LLMs), electronic vehicles (EVs) and automotive, mobile, wearables, smart consumer, edge computing, and material sciences of the Italian ecosystem, and revolutionize Europe’s position in the global [semiconductors] supply chain,” said Dr. Sehat Sutardja, co-founder and Chairman of Silicon Box. “Throughout my career, I have always been a big believer in Italian and European ingenuity.”

Advanced Packaging to Drive Innovation across Italian and European Semiconductor Ecosystems 

Italy was chosen as the location for Silicon Box’s first global expansion for several reasons, including its infrastructure, strong talent base and the government’s initiative to support and streamline the business environment and key stakeholder conversations,” said Dr. Han. “The competitive jobs that Silicon Box’s new facility will create will include engineers, equipment technicians, factory operators, and business functions. Italy offers an exceptional ecosystem for higher education with strong traditions in various engineering disciplines. This was a decisive factor in Silicon Box’s choice to build in Northern Italy and will be essential to our long-term success.”

Wafer fabrication facilities, often referred to as “fabs”, create chips on silicon wafers through various advanced processes. Packaging facilities, such as the one planned for Italy by Silicon Box, receive completed wafers from fabs, cut them into individual chips, assemble or “package” them into final products and test them for performance and quality. The finished or packaged chips are then shipped to customers which include specialty chip design companies, integrated device manufacturers (IDMs) and original equipment manufacturers (OEMs).

Notably, Silicon Box facilities specialize in advanced chiplet integration capabilities (“advanced packaging”), on a large manufacturing format for scale. The chiplet concept is an alternative to traditional semiconductor manufacturing, which focused on building entire systems-on-chips (SoCs) on silicon wafers, then moving to conventional packaging processes. Chiplets describe manufacture of individual system modalities as standalone chips or chiplets on a wafer, then integrating these separate functionalities into a system through advanced packaging, creating a system-in-package (SiPs). With this, advanced packaging technology comes to the forefront of semiconductor manufacturing innovation, in a new paradigm for the industry.

The chiplet concept itself was introduced by Silicon Box co-founder Dr. Sutardja at the International Solid State Circuits Conference (ISSCC) in 2015, where he was plenary speaker. Dr. Han is the inventor of semiconductor packaging solutions fundamental to enable chiplets through advanced packaging. Their collaboration has been the basis for Silicon Box’s record-breaking progress as a company in the semiconductor manufacturing space, traditionally dominated by a few large companies. 

Bringing Resilience and Sustainability to the Semiconductor Supply Chain, and Enabling Advanced AI Technology and Ecosystems in Europe

“Silicon Box’s new foundry in Italy will be able to accept wafers from all foundries and support a wide variety of customers, worldwide, through its innovative approach,” said Mike Han, Silicon Box’s Head of Business. “The location is well suited to work with Europe’s existing and planned semiconductor wafer fabrication clusters in Italy, Germany, and France. Proximity will enable close collaboration from design through to final manufacturing, and help increase resilience and cost efficiency of the European and global semiconductor supply chain, at a time when there is a global shortage for this type of technology.”

“Silicon Box’s investment in Italy can act as a catalyst for further investments by ecosystem companies and for building and attracting the talent needed to support a thriving European semiconductor industry,” co-founder Weili Dai said.  “It will also enable existing Italian and European semiconductor interests to maximize their existing core competencies and drive further efficiency and innovation through the creative and cost-efficient deployment of advanced packaging and chiplet architecture to support their own strategic objectives. This is particularly significant for the development of native artificial intelligence, large language models, supercomputers, mobile, wearables, smart factories, and edge computing companies.” 

“This new Silicon Box AI-powered smart factory will be the first to showcase the ecosystem’s technology end-to-end; from initial design and construction to full process automation, as well as employee and customer training from our comprehensive digital twin. This will facilitate seamless expansion, employee and customer immersion, and groundbreaking efficiencies in management and performance monitoring,” she added.

Recent global disruptions emphasize the need to build a more resilient supply chain for semiconductors in Europe. Silicon Box supports the European Commission’s goal to reclaim 20 percent of global semiconductor manufacturing capacity by 2030, and is committed to supporting a vision of a global semiconductor supply chain that is resilient and geographically balanced. 

Silicon Box built it’s first advanced packaging facility in Singapore within a year, and began shipping finished products to customers three months after the factory’s grand opening, showcasing unique capability for fast project execution, which will also apply to the Italian factory. 

Silicon Box’s products and practices are committed to sustainability and will adhere to high environmental standards across its global operations.  This will also apply to Silicon Box’s first global facility in Northern Italy. This facility will be constructed and managed according to Europe’s net zero principles, minimizing its carbon footprint and the impact on the environment.

Forward-Looking Statements

This press release contains forward-looking statements that involve a number of risks and uncertainties. Such statements include: our manufacturing expansion and investment plans and expectations in the European Union (EU) and the anticipated benefits therefrom; anticipated supplier, ecosystem, community, and government support and approval for our planned EU investments and anticipated benefits related to such support; environmental plans for and benefits from our factories and technologies; and other characterizations of future plans, expectations, events, or circumstances.

Such statements involve risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including: changes in demand for our products; Silicon Box’s failure to realize the anticipated benefits of its strategy, plans, and proposed transactions; construction delays or changes in plans due to business, economic, or other factors; increases in capital requirements and changes in capital investment plans; adverse changes in anticipated government incentives and associated approval related to Silicon Box’s planned EU investments; adverse legislative or other government actions; insufficient ecosystem support; the impact of macroeconomic and geopolitical trends and events; and other risks and uncertainties described in this press release.

All information in this press release reflects management’s views as of the date hereof, unless an earlier date is specified. We do not undertake, and expressly disclaims any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law.

About Silicon Box

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as well as high performance alternatives to traditional packaging schemes.  Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of chiplet adoption in order to build the emergent technologies shaping the world around us today.

Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja and Weili Dai.  Dr. Han was previously the Chairman, CEO and CTO of the world’s 3rd largest outsourced assembly and test provider, STATS Chippac (SSE: 600584) for two decades, taking the company to $4B in revenue during his tenure.  Dr. Han is the inventor of many of the most advanced packaging solutions in today’s market, and his team at Silicon Box holds standing records for yield in advanced packaging technology at wafer level production.   Dr. Sutardja introduced the concept of chiplets at the International Solid-State Circuits Conference (ISSCC) in 2015.  He and Weili Dai founded Marvell Technology Group (NASDAQ: MRVL) in 1995, and ran the company for twenty years from a start-up to an over $50B market value company.

To learn more about Silicon Box go to: and

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Invitation to presentation of EQT AB’s Q1 Announcement 2024




STOCKHOLM, April 5, 2024 /PRNewswire/ — EQT AB’s Q1 Announcement 2024 will be published on Thursday 18 April 2024 at approximately 07:30 CEST. EQT will host a conference call at 08:30 CEST to present the report, followed by a Q&A session.

The presentation and a video link for the webcast will be available here from the time of the publication of the Q1 Announcement.

To participate by phone and ask questions during the Q&A, please register here in advance. Upon registration, you will receive your personal dial-in details.

The webcast can be followed live here and a recording will be available afterwards.

Information on EQT AB’s financial reporting

The EQT AB Group has a long-term business model founded on a promise to its fund investors to invest capital, drive value creation and create consistent attractive returns over a 5 to 10-year horizon. The Group’s financial model is primarily affected by the size of its fee-generating assets under management, the performance of the EQT funds and its ability to recruit and retain top talent.

The Group operates in a market driven by long-term trends and thus believes quarterly financial statements are less relevant for investors. However, in order to provide the market with relevant and suitable information about the Group’s development, EQT publishes quarterly announcements with key operating numbers that are relevant for the business performance (taking Nasdaq’s guidance note for preparing interim management statements into consideration). In addition, a half-year report and a year-end report including financial statements and further information relevant for investors is published. Finally, EQT also publishes an annual report including sustainability reporting.

Olof Svensson, Head of Shareholder Relations, +46 72 989 09 15
EQT Shareholder Relations, [email protected]

Rickard Buch, Head of Corporate Communications, +46 72 989 09 11
EQT Press Office, [email protected], +46 8 506 55 334

This information was brought to you by Cision,c3956826

The following files are available for download:

Invitation to presentation of EQT AB’s Q1 Announcement 2024,c3285895

EQT AB Group


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Kia presents roadmap to lead global electrification era through EVs, HEVs and PBVs



  • Kia drives forward transformation into ‘Sustainable Mobility Solutions Provider’
  • Roadmap enables Kia to proactively respond to uncertainties in mobility industry landscape, including changes in EV market
  • Company to expand EV line-up with more models; enhance HEV line-up to manage fluctuation in EV demand
    • Goal to sell 1.6 million EVs annually in 2030, introducing 15 models
    • PBV to play a key role in Kia’s growth, targeting 250,000 PBV sales annually by 2030 with PV5 and PV7 models
  • Kia to invest KRW 38 trillion by 2028, including KRW 15 trillion for future business
  • 2024 business guidance : KRW 101 tln in revenue with KRW 12 tln in operating profit; operating profit margin of 11.9% on sales of 3.2 million units globally
  • CEO reaffirms Kia’s commitment to ESG management

SEOUL, South Korea, April 5, 2024 /PRNewswire/ — Kia Corporation (Kia) today shared an update on its future strategies and financial targets at its CEO Investor Day in Seoul, Korea.

Based on its innovative achievements in the years since the announcement of mid-to-long-term business initiatives, Kia is focusing on updating its 2030 strategy announced last year and further strengthening its business strategy in response to uncertainties across the global mobility industry landscape.

During the event, Kia updated its mid-to-long-term business strategy with a focus on electrification, and its PBV business. Kia reiterated its 2030 annual sales target of 4.3 million units, including 1.6 million units of electric vehicles (EVs). The 2030 4.3 million annual sales target is 34.4 percent higher than the brand’s 2024 annual goal of 3.2 million units.

The company also plans to become a leading EV brand by selling a higher percentage of electrified models among its total sales, including hybrid electric vehicles (HEV), plug-in hybrid (PHEV), and battery EVs, projecting electrified model sales of 2.48 million units annually or 58 percent of Kia’s total sales in 2030.

“Following our successful brand relaunch in 2021, Kia is enhancing its global business strategy to further the establishment of an innovative EV line-up and accelerate the company’s transition to a sustainable mobility solutions provider,” said Ho Sung Song, President and CEO of Kia. “By responding effectively to changes in the mobility market and efficiently implementing mid-to-long-term strategies, Kia is strengthening its brand commitment to the wellbeing of customers, communities, the global society, and the environment.”

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BioVaxys Technology Corp. Provides Bi-Weekly MCTO Status Update




VANCOUVER, BC, April 4, 2024 /PRNewswire/ — BioVaxys Technology Corp. (CSE: BIOV) (FRA: 5LB) (OTCQB: BVAXF) (the “Company“) is providing this bi-weekly update on the status of the management cease trade order granted on February 29, 2024 (the “MCTO“), by its principal regulator, the Ontario Securities Commission (the “OSC“), under National Policy 12-203 – Management Cease Trade Orders (“NP 12-203“), following the Company’s announcement on February 21, 2024 (the “Default Announcement“), that it was unable to file its audited annual financial statements for the year ended October 31, 2023, its management’s discussion and analysis of financial statements for the year ended October 31, 2023, its annual information form for the year ended October 31, 2023, and related filings (collectively, the “Required Annual Filings“). Under National Instrument 51-102, the Required Annual Filings were required to be made no later than February 28, 2024.

As a result of the delay in filing the Required Annual Filings, the Company was unable to file its interim financial statements for the three months ended January 31, 2024, its management’s discussion and analysis of financial statements for the three months ended January 31, 2024, and related filings (collectively, the “Required Interim Filings“). Under National Instrument 51-102, the Required Interim Filings were required to be made no later than April 1, 2024.

The Company anticipates filing the Required Annual Filings by April 30, 2024. The auditor of the Company requires additional time to complete its audit of the Company, including the Company’s recent acquisition of all intellectual property, immunotherapeutics platform technologies, and clinical stage assets of the former IMV Inc. that closed on February 16, 2024. In addition, the Company anticipates filing the Required Interim Filings immediately after the filing of the Required Annual Filings.

Except as herein disclosed, there are no material changes to the information contained in the Default Announcement. In addition, (i) the Company is satisfying and confirms that it intends to continue to satisfy the provisions of the alternative information guidelines under NP 12-203 and issue bi-weekly default status reports for so long as the delay in filing the Required Annual Filings and/or Required Interim Filings is continuing, each of which will be issued in the form of a press release; (ii) the Company does not have any information at this time regarding any anticipated specified default subsequent to the default in filing the Required Annual Filings and Required Interim Filings; (iii) the Company is not subject to any insolvency proceedings; and (iv) there is no material information concerning the affairs of the Company that has not been generally disclosed.

About BioVaxys Technology Corp.

BioVaxys Technology Corp. (, a biopharmaceuticals company registered in British Columbia, Canada, is a clinical-stage biopharmaceutical company dedicated to improving patient lives with novel immunotherapies based on the DPX™ immune-educating technology platform and it’s HapTenix© ‘neoantigen’ tumor cell construct platform, for treating cancers, infectious disease, antigen desensitization, and other immunological fields. The Company’s clinical stage pipeline includes maveropepimut-S which is in Phase II clinical development for advanced Relapsed-Refractory Diffuse Large B Cell Lymphoma (DLBCL) and platinum resistant ovarian cancer, and BVX-0918, a personalized immunotherapeutic vaccine using it proprietary HapTenix© ‘neoantigen’ tumor cell construct platform which is soon to enter Phase I in Spain for treating refractive late-stage ovarian cancer. The Company is also capitalizing on its tumor immunology know-how and creation of a unique library of T-lymphocytes & other datasets post-vaccination with its personalized immunotherapeutic vaccines to utilize predictive algorithms and other technologies to identify new targetable tumor antigens. BioVaxys common shares are listed on the CSE under the stock symbol “BIOV” and trade on the Frankfurt Bourse (FRA: 5LB) and in the US (OTCQB: BVAXF). For more information, visit and connect with us on X and LinkedIn.


Signed “James Passin
James Passin, Chief Executive Officer
Phone: +1 646 452 7054

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