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Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 – Exclusive Report by MarketsandMarkets™

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CHICAGO, March 25, 2024 /PRNewswire/ — The report Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region – Global Forecast to 2029″, is USD 43.9 billion in 2024 and is projected to reach USD 70.9 billion by 2029, at a CAGR of 10.1%.

The semiconductor and IC packaging materials market is propelled by several key drivers. These include the increasing demand for advanced packaging solutions driven by technological advancements in semiconductor devices, the growing market for consumer electronics and IoT devices, the need for compact and lightweight packaging materials, and the rising trend of miniaturization in electronics. Additionally, factors such as the emergence of new applications like autonomous vehicles and 5G technology, along with the expansion of the semiconductor industry in regions like Asia Pacific, contribute significantly to the growth and evolution of the semiconductor and IC packaging materials market.

Browse in-depth TOC on “Semiconductor & IC packaging materials Market”

140 – Tables

40 – Figures

200 – Pages

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Small outline package (SOP) by packaging technology is projected to be the largest, in terms of value, during the forecast period

The dominance of small outline package (SOP) technology in the semiconductor and IC packaging materials market stems from its numerous advantages. First and foremost, SOPs excel in compactness and low profile, making them ideal for applications with space constraints like mobile devices, wearables, and IoT gadgets. This compact design not only reduces material usage but also lowers package weight, crucial for industries focusing on lightweight and portable electronics. Moreover, SOPs boast a small lead pitch, allowing for higher pin density and better integration of semiconductor components, thereby enhancing functionality within a smaller footprint. Additionally, SOPs are compatible with surface mount technology (SMT), enabling automated assembly processes that enhance production efficiency and cut manufacturing costs. This compatibility also improves thermal management as SOPs can be directly mounted onto the PCB, enhancing heat dissipation and device reliability. The versatility of SOP technology is evident in its various package configurations, such as SOP-8, SOP-16, and SOP-28, catering to a broad spectrum of semiconductor applications and needs. Furthermore, SOPs deliver strong electrical performance with low parasitic capacitance and inductance, vital for high-speed digital and analog applications. They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices. In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.

Organic substrate by type is projected to be the largest, in terms of value, during the forecast period

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The organic substrate segment reigns as the dominant type in semiconductor and IC packaging materials for several key reasons. Firstly, organic substrates, notably printed circuit boards (PCBs), offer a cost-effective solution compared to alternatives like ceramic packages. This cost efficiency is pivotal in mass production, aligning well with the semiconductor industry’s pursuit of economies of scale. Furthermore, organic substrates boast excellent electrical insulation properties, crucial for averting electrical shorts and preserving signal integrity within packages. Their versatility enables intricate designs and the integration of multiple components on a single board, providing flexibility in packaging solutions for diverse semiconductor applications. Their lightweight nature, contrasting with materials such as leadframes or ceramics, aids in system miniaturization and enhances electronic device portability. Additionally, organic substrates are easily manufactured using standard PCB fabrication processes, resulting in faster production cycles and reduced time-to-market for semiconductor products. Technological advancements in organic substrate materials, such as high-speed laminate materials and low-loss dielectrics, have further bolstered their performance in terms of signal transmission and thermal management, rendering them a favored choice for modern semiconductor packaging. In summary, the amalgamation of cost-effectiveness, electrical insulation, design flexibility, lightweight properties, ease of manufacturing, and ongoing technological enhancements firmly establishes organic substrates as the leading segment in semiconductor and IC packaging materials.

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Consumer electronics by end-use industry segment is projected to be the largest, in terms of value, during the forecast period

Consumer electronics leads the semiconductor and IC packaging materials market due to robust demand across diverse products like smartphones, tablets, laptops, and wearables. These devices drive the need for advanced packaging materials to meet performance and miniaturization demands. Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management. Cost-effective solutions and global market adoption further boost the demand, driving economies of scale and innovation in packaging technologies. Consumer preferences for sleek, energy-efficient devices also influence material choices, making consumer electronics the key driver of growth in this market.

Asia Pacific is expected to be the fastest growing market for semiconductor & IC packaging materials during the forecast period, in terms of value

Asia Pacific has emerged as the leading market for semiconductor and IC packaging materials, driven by its role as a global electronics manufacturing powerhouse featuring major players such as China, Japan, South Korea, Taiwan, and Singapore, all boasting robust semiconductor ecosystems. This region’s strong focus on technological innovation, especially exemplified by leaders like South Korea and Japan, fuels the demand for cutting-edge packaging materials that can meet the demanding standards of advanced semiconductor devices. Additionally, Asia Pacific benefits from a thriving consumer electronics sector, fueled by increasing disposable incomes and the rapid digitalization of society. This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics. Furthermore, Asia Pacific’s strategic advantages as a cost-effective manufacturing hub with efficient supply chains and a skilled workforce further reinforce its dominance in the semiconductor industry. Government initiatives and favorable business environments in key countries such as China, Taiwan, and Singapore play a crucial role in enhancing the region’s position as the primary driver of growth and innovation in the global semiconductor and IC packaging materials market.

Key Players

The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan)  etc.

Browse Adjacent Market: Advanced Materials Market Research Reports & Consulting

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What Hebei Can Offer丨Hebei Steel Forging Future

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SHIJIAZHUANG, China, Jan. 8, 2025 /PRNewswire/ — A news report from Great Wall New Media — Steel is the primary pillar industry of Hebei Province. Relying on abundant resource endowments, a complete industrial chain, and modern technological advantages, Hebei’s steel industry has gradually formed an industrial cluster centered around Tangshan, Handan, Shijiazhuang, Chengde, and other key areas.

In recent years, Hebei has been actively promoting the steel industry’s transition towards intelligence, sustainability, and internationalization. Its products are widely exported to 20 countries and regions, becoming a crucial support for infrastructure construction in Belt and Road countries. 

Today, let’s follow Xiao Wan from France to unlock the secrets of steel.

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JLL APAC Applauded by Frost & Sullivan for Enhancing Property Performance and Delivering Customer Value in Real Estate

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JLL APAC’s deep industry expertise, state-of-the-art capabilities, and customer-driven approach position it to redefine the FM industry and reinforce its leadership.

SAN ANTONIO, Jan. 8, 2025 /PRNewswire/ — Frost & Sullivan recently researched the facility management industry and, based on its analysis, recognizes Jones Lang LaSalle (JLL) Asia-Pacific (APAC) with the 2024 Asia-Pacific Company of the Year Award. The company is a global real estate leader that helps enterprises optimize real estate strategies to meet their operational needs and business goals. The company offers comprehensive solutions and services across the real estate spectrum, including integrated facility management (IFM). With its innovative, cutting-edge solution suite, JLL APAC enhances property performance, fosters ideal work experiences, and delivers value for clients spanning multiple industries, such as finance, government, information technology, and manufacturing. It integrates advanced technology, leverages scientific insights, and designs sustainable spaces to drive innovation and deliver significant customer value. The company goes beyond traditional FM practices, exploring neuroscientific principles to develop its innovative solutions.

JLL APAC’s Work Science initiative studies unique individual work patterns and diverse cognitive styles to power its human-centric workspace designs and create optimal work environments. It enhances workforce productivity, collaboration, and employee well-being and satisfaction. Aimed at helping C-suite executives and senior leaders tackle complex challenges and drive their organizations forward, the value-added JLL Future Labs service curates immersive, multi-sensory collaboration experiences that foster innovative thinking and synergy and accelerate decision-making. JLL APAC leverages artificial intelligence (AI) and machine learning to unify operations among diverse facility management stakeholders and eliminate data silos, enhancing collaboration and decision-making toward optimized building performance. Its comprehensive AI-enhanced JLL Serve FM application streamlines operations, automates processes, digitizes maintenance and reporting, and provides real-time visibility to optimize building usage, minimize costs, save time, and boost returns.

Janice Wung, industry principal at Frost & Sullivan, observed, “JLL APAC’s bold approach to exploring innovative insights beyond traditional FM scope, such as neuroscientific principles, enhance its solutions and deliver impactful results. Its foresight in technology integration is a key differentiator, empowering the company to remain at the forefront of the industry and capitalize on emerging market opportunities.”

JLL APAC’s Smart Building Platform helps clients enhance operational performance with real-time and remote asset monitoring, enabling continuous oversight, rapid problem detection, predictive maintenance, and improved occupant comfort. The platform drives cost optimization, enhances operational efficiency, and promotes sustainability while ensuring occupant comfort and safety. JLL APAC’s expert integration of the Internet of Things, big data, and intelligent technology enhances service excellence, promoting sustainability and propelling the FM industry into the future. Furthermore, its world’s first large language model specifically for the commercial real estate industry, the JLL Generative Pre-trained Transformer (JLL GPT) AI platform, performs comprehensive multi-source data analytics to provide clients with intelligent insights that drive informed strategies and enhance returns. JLL APAC’s customer-centric and collaborative approach, deep expertise, and reliability in addressing client pain points resulted in an impressive global Net Promoter Score of 100%, establishing a new regional record. Regardless of macroeconomic and business conditions, its steady growth momentum positions it to thrive and continue expanding its market presence.

“JLL APAC prioritizes mutual interests to drive value creation and sustainable growth for all stakeholders involved, redefining business partnerships in the FM industry. By adopting progressive, customer-centric strategies and fostering enduring relationships through collaboration, value creation, and service excellence, JLL APAC is well-positioned to lead the FM industry into the future,” added Rubini Kamal, best practices research analyst at Frost & Sullivan. With its strong overall performance, JLL APAC earns Frost & Sullivan’s 2024 Asia Pacific Company of the Year Award in the facility management industry.

Each year, Frost & Sullivan presents a Company of the Year award to the organization that demonstrates excellence in terms of growth strategy and implementation in its field. The award recognizes a high degree of innovation with products and technologies, and the resulting leadership in terms of customer value and market penetration.

Frost & Sullivan Best Practices awards recognize companies in various regional and global markets for demonstrating outstanding achievement and superior performance in leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analyses, and extensive secondary research to identify best practices in the industry.

About Frost & Sullivan

For six decades, Frost & Sullivan has been world-renowned for its role in helping investors, corporate leaders, and governments navigate economic changes and identify disruptive technologies, megatrends, new business models, and companies to action, resulting in a continuous flow of growth opportunities to drive future success. Contact us: Start the discussion. Contact us: Start the discussion.

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Contact:

Tarini Singh
E: [email protected]

About JLL APAC
For over 200 years, JLL (NYSE: JLL), a leading global commercial real estate and investment management company, has helped clients buy, build, occupy, manage and invest in a variety of commercial, industrial, hotel, residential and retail properties. A Fortune 500 company with annual revenue of $20.8 billion and operations in over 80 countries around the world, our more than 110,000 employees bring the power of a global platform combined with local expertise. Driven by our purpose to shape the future of real estate for a better world, we help our clients, people and communities SEE A BRIGHTER WAYSM. JLL is the brand name, and a registered trademark, of Jones Lang LaSalle Incorporated. For further information, please visit www.jll.com

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PostEra announces expansion to $610M in their AI drug discovery collaboration with Pfizer

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BOSTON, Jan. 7, 2025 /PRNewswire/ — PostEra, a biotechnology company specializing in machine learning for preclinical drug discovery, today announced an expansion of their partnership with Pfizer. The parties will launch a new Antibody-Drug-Conjugate (ADC) collaboration while also expanding their existing $260M AI Lab collaboration, which itself was built upon a successful Generative Chemistry partnership.

The teams will leverage PostEra’s AI platform, Proton, a pioneering innovation in generative chemistry and synthesis-aware design, to advance several programs. These new programs include small molecule therapeutics as well as ADCs, where PostEra will use Proton to optimize properties of payloads.

PostEra will receive an upfront payment of $12M and is eligible to receive additional milestone payments and tiered royalties on any approved products arising out of the collaboration.

Over the last 3 years, as part of the AI Lab, PostEra and Pfizer scientists have partnered closely to advance several small molecule programs. After Pfizer nominated the maximum number of programs, the teams have agreed to expand the collaboration to include additional targets with PostEra receiving additional upfront payment and eligibility for milestones and royalties.

“We’re pleased to significantly expand the use of PostEra’s Proton platform. This builds on peer-reviewed publications with Pfizer validating the real-world impact of AI-driven drug discovery in hitting preclinical milestones faster than anticipated,” said Alpha Lee, Chief Scientific Officer of PostEra. “This third partnership with our long-term collaborators at Pfizer underscores Proton’s depth and strength in making a meaningful impact on real-world drug discovery campaigns,” added Aaron Morris, CEO of PostEra.

About PostEra
PostEra is building a modern 21st century biopharma. We use Proton, our AI platform for medicinal chemistry, to accelerate the discovery of new medicines for patients. PostEra is advancing an internal pipeline while also advancing small molecule programs through partnerships with biopharma. We’ve closed over $1Bn in AI partnerships including 4 multi-year agreements with Pfizer and Amgen. PostEra is also leading an antiviral drug discovery center for pandemic preparedness, funded by one of the largest grants in NIH history.

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