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Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 – Exclusive Report by MarketsandMarkets™




CHICAGO, March 25, 2024 /PRNewswire/ — The report Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region – Global Forecast to 2029″, is USD 43.9 billion in 2024 and is projected to reach USD 70.9 billion by 2029, at a CAGR of 10.1%.

The semiconductor and IC packaging materials market is propelled by several key drivers. These include the increasing demand for advanced packaging solutions driven by technological advancements in semiconductor devices, the growing market for consumer electronics and IoT devices, the need for compact and lightweight packaging materials, and the rising trend of miniaturization in electronics. Additionally, factors such as the emergence of new applications like autonomous vehicles and 5G technology, along with the expansion of the semiconductor industry in regions like Asia Pacific, contribute significantly to the growth and evolution of the semiconductor and IC packaging materials market.

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Small outline package (SOP) by packaging technology is projected to be the largest, in terms of value, during the forecast period

The dominance of small outline package (SOP) technology in the semiconductor and IC packaging materials market stems from its numerous advantages. First and foremost, SOPs excel in compactness and low profile, making them ideal for applications with space constraints like mobile devices, wearables, and IoT gadgets. This compact design not only reduces material usage but also lowers package weight, crucial for industries focusing on lightweight and portable electronics. Moreover, SOPs boast a small lead pitch, allowing for higher pin density and better integration of semiconductor components, thereby enhancing functionality within a smaller footprint. Additionally, SOPs are compatible with surface mount technology (SMT), enabling automated assembly processes that enhance production efficiency and cut manufacturing costs. This compatibility also improves thermal management as SOPs can be directly mounted onto the PCB, enhancing heat dissipation and device reliability. The versatility of SOP technology is evident in its various package configurations, such as SOP-8, SOP-16, and SOP-28, catering to a broad spectrum of semiconductor applications and needs. Furthermore, SOPs deliver strong electrical performance with low parasitic capacitance and inductance, vital for high-speed digital and analog applications. They also offer robust protection against environmental factors like moisture and mechanical stress, ensuring the durability and reliability of semiconductor devices. In essence, the amalgamation of compactness, high pin density, SMT compatibility, thermal management capabilities, versatility, and excellent electrical performance positions SOP technology as the preferred choice in the semiconductor and IC packaging materials market.

Organic substrate by type is projected to be the largest, in terms of value, during the forecast period

The organic substrate segment reigns as the dominant type in semiconductor and IC packaging materials for several key reasons. Firstly, organic substrates, notably printed circuit boards (PCBs), offer a cost-effective solution compared to alternatives like ceramic packages. This cost efficiency is pivotal in mass production, aligning well with the semiconductor industry’s pursuit of economies of scale. Furthermore, organic substrates boast excellent electrical insulation properties, crucial for averting electrical shorts and preserving signal integrity within packages. Their versatility enables intricate designs and the integration of multiple components on a single board, providing flexibility in packaging solutions for diverse semiconductor applications. Their lightweight nature, contrasting with materials such as leadframes or ceramics, aids in system miniaturization and enhances electronic device portability. Additionally, organic substrates are easily manufactured using standard PCB fabrication processes, resulting in faster production cycles and reduced time-to-market for semiconductor products. Technological advancements in organic substrate materials, such as high-speed laminate materials and low-loss dielectrics, have further bolstered their performance in terms of signal transmission and thermal management, rendering them a favored choice for modern semiconductor packaging. In summary, the amalgamation of cost-effectiveness, electrical insulation, design flexibility, lightweight properties, ease of manufacturing, and ongoing technological enhancements firmly establishes organic substrates as the leading segment in semiconductor and IC packaging materials.

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Consumer electronics by end-use industry segment is projected to be the largest, in terms of value, during the forecast period

Consumer electronics leads the semiconductor and IC packaging materials market due to robust demand across diverse products like smartphones, tablets, laptops, and wearables. These devices drive the need for advanced packaging materials to meet performance and miniaturization demands. Additionally, rapid innovation in technologies such as AI, AR, and IoT requires packaging materials supporting high-speed data processing and thermal management. Cost-effective solutions and global market adoption further boost the demand, driving economies of scale and innovation in packaging technologies. Consumer preferences for sleek, energy-efficient devices also influence material choices, making consumer electronics the key driver of growth in this market.

Asia Pacific is expected to be the fastest growing market for semiconductor & IC packaging materials during the forecast period, in terms of value

Asia Pacific has emerged as the leading market for semiconductor and IC packaging materials, driven by its role as a global electronics manufacturing powerhouse featuring major players such as China, Japan, South Korea, Taiwan, and Singapore, all boasting robust semiconductor ecosystems. This region’s strong focus on technological innovation, especially exemplified by leaders like South Korea and Japan, fuels the demand for cutting-edge packaging materials that can meet the demanding standards of advanced semiconductor devices. Additionally, Asia Pacific benefits from a thriving consumer electronics sector, fueled by increasing disposable incomes and the rapid digitalization of society. This sector heavily relies on semiconductor and IC packaging materials for a wide array of products including smartphones, laptops, wearables, and automotive electronics. Furthermore, Asia Pacific’s strategic advantages as a cost-effective manufacturing hub with efficient supply chains and a skilled workforce further reinforce its dominance in the semiconductor industry. Government initiatives and favorable business environments in key countries such as China, Taiwan, and Singapore play a crucial role in enhancing the region’s position as the primary driver of growth and innovation in the global semiconductor and IC packaging materials market.

Key Players

The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan)  etc.

Browse Adjacent Market: Advanced Materials Market Research Reports & Consulting

Related Reports:

Semiconductor Chemical Market – Global Forecast to 2028

About MarketsandMarkets™

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The B2B economy is witnessing the emergence of $25 trillion of new revenue streams that are substituting existing revenue streams in this decade alone. We work with clients on growth programs, helping them monetize this $25 trillion opportunity through our service lines – TAM Expansion, Go-to-Market (GTM) Strategy to Execution, Market Share Gain, Account Enablement, and Thought Leadership Marketing.

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Invitation to presentation of EQT AB’s Q1 Announcement 2024




STOCKHOLM, April 5, 2024 /PRNewswire/ — EQT AB’s Q1 Announcement 2024 will be published on Thursday 18 April 2024 at approximately 07:30 CEST. EQT will host a conference call at 08:30 CEST to present the report, followed by a Q&A session.

The presentation and a video link for the webcast will be available here from the time of the publication of the Q1 Announcement.

To participate by phone and ask questions during the Q&A, please register here in advance. Upon registration, you will receive your personal dial-in details.

The webcast can be followed live here and a recording will be available afterwards.

Information on EQT AB’s financial reporting

The EQT AB Group has a long-term business model founded on a promise to its fund investors to invest capital, drive value creation and create consistent attractive returns over a 5 to 10-year horizon. The Group’s financial model is primarily affected by the size of its fee-generating assets under management, the performance of the EQT funds and its ability to recruit and retain top talent.

The Group operates in a market driven by long-term trends and thus believes quarterly financial statements are less relevant for investors. However, in order to provide the market with relevant and suitable information about the Group’s development, EQT publishes quarterly announcements with key operating numbers that are relevant for the business performance (taking Nasdaq’s guidance note for preparing interim management statements into consideration). In addition, a half-year report and a year-end report including financial statements and further information relevant for investors is published. Finally, EQT also publishes an annual report including sustainability reporting.

Olof Svensson, Head of Shareholder Relations, +46 72 989 09 15
EQT Shareholder Relations, [email protected]

Rickard Buch, Head of Corporate Communications, +46 72 989 09 11
EQT Press Office, [email protected], +46 8 506 55 334

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EQT AB Group


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Kia presents roadmap to lead global electrification era through EVs, HEVs and PBVs



  • Kia drives forward transformation into ‘Sustainable Mobility Solutions Provider’
  • Roadmap enables Kia to proactively respond to uncertainties in mobility industry landscape, including changes in EV market
  • Company to expand EV line-up with more models; enhance HEV line-up to manage fluctuation in EV demand
    • Goal to sell 1.6 million EVs annually in 2030, introducing 15 models
    • PBV to play a key role in Kia’s growth, targeting 250,000 PBV sales annually by 2030 with PV5 and PV7 models
  • Kia to invest KRW 38 trillion by 2028, including KRW 15 trillion for future business
  • 2024 business guidance : KRW 101 tln in revenue with KRW 12 tln in operating profit; operating profit margin of 11.9% on sales of 3.2 million units globally
  • CEO reaffirms Kia’s commitment to ESG management

SEOUL, South Korea, April 5, 2024 /PRNewswire/ — Kia Corporation (Kia) today shared an update on its future strategies and financial targets at its CEO Investor Day in Seoul, Korea.

Based on its innovative achievements in the years since the announcement of mid-to-long-term business initiatives, Kia is focusing on updating its 2030 strategy announced last year and further strengthening its business strategy in response to uncertainties across the global mobility industry landscape.

During the event, Kia updated its mid-to-long-term business strategy with a focus on electrification, and its PBV business. Kia reiterated its 2030 annual sales target of 4.3 million units, including 1.6 million units of electric vehicles (EVs). The 2030 4.3 million annual sales target is 34.4 percent higher than the brand’s 2024 annual goal of 3.2 million units.

The company also plans to become a leading EV brand by selling a higher percentage of electrified models among its total sales, including hybrid electric vehicles (HEV), plug-in hybrid (PHEV), and battery EVs, projecting electrified model sales of 2.48 million units annually or 58 percent of Kia’s total sales in 2030.

“Following our successful brand relaunch in 2021, Kia is enhancing its global business strategy to further the establishment of an innovative EV line-up and accelerate the company’s transition to a sustainable mobility solutions provider,” said Ho Sung Song, President and CEO of Kia. “By responding effectively to changes in the mobility market and efficiently implementing mid-to-long-term strategies, Kia is strengthening its brand commitment to the wellbeing of customers, communities, the global society, and the environment.”

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BioVaxys Technology Corp. Provides Bi-Weekly MCTO Status Update




VANCOUVER, BC, April 4, 2024 /PRNewswire/ — BioVaxys Technology Corp. (CSE: BIOV) (FRA: 5LB) (OTCQB: BVAXF) (the “Company“) is providing this bi-weekly update on the status of the management cease trade order granted on February 29, 2024 (the “MCTO“), by its principal regulator, the Ontario Securities Commission (the “OSC“), under National Policy 12-203 – Management Cease Trade Orders (“NP 12-203“), following the Company’s announcement on February 21, 2024 (the “Default Announcement“), that it was unable to file its audited annual financial statements for the year ended October 31, 2023, its management’s discussion and analysis of financial statements for the year ended October 31, 2023, its annual information form for the year ended October 31, 2023, and related filings (collectively, the “Required Annual Filings“). Under National Instrument 51-102, the Required Annual Filings were required to be made no later than February 28, 2024.

As a result of the delay in filing the Required Annual Filings, the Company was unable to file its interim financial statements for the three months ended January 31, 2024, its management’s discussion and analysis of financial statements for the three months ended January 31, 2024, and related filings (collectively, the “Required Interim Filings“). Under National Instrument 51-102, the Required Interim Filings were required to be made no later than April 1, 2024.

The Company anticipates filing the Required Annual Filings by April 30, 2024. The auditor of the Company requires additional time to complete its audit of the Company, including the Company’s recent acquisition of all intellectual property, immunotherapeutics platform technologies, and clinical stage assets of the former IMV Inc. that closed on February 16, 2024. In addition, the Company anticipates filing the Required Interim Filings immediately after the filing of the Required Annual Filings.

Except as herein disclosed, there are no material changes to the information contained in the Default Announcement. In addition, (i) the Company is satisfying and confirms that it intends to continue to satisfy the provisions of the alternative information guidelines under NP 12-203 and issue bi-weekly default status reports for so long as the delay in filing the Required Annual Filings and/or Required Interim Filings is continuing, each of which will be issued in the form of a press release; (ii) the Company does not have any information at this time regarding any anticipated specified default subsequent to the default in filing the Required Annual Filings and Required Interim Filings; (iii) the Company is not subject to any insolvency proceedings; and (iv) there is no material information concerning the affairs of the Company that has not been generally disclosed.

About BioVaxys Technology Corp.

BioVaxys Technology Corp. (, a biopharmaceuticals company registered in British Columbia, Canada, is a clinical-stage biopharmaceutical company dedicated to improving patient lives with novel immunotherapies based on the DPX™ immune-educating technology platform and it’s HapTenix© ‘neoantigen’ tumor cell construct platform, for treating cancers, infectious disease, antigen desensitization, and other immunological fields. The Company’s clinical stage pipeline includes maveropepimut-S which is in Phase II clinical development for advanced Relapsed-Refractory Diffuse Large B Cell Lymphoma (DLBCL) and platinum resistant ovarian cancer, and BVX-0918, a personalized immunotherapeutic vaccine using it proprietary HapTenix© ‘neoantigen’ tumor cell construct platform which is soon to enter Phase I in Spain for treating refractive late-stage ovarian cancer. The Company is also capitalizing on its tumor immunology know-how and creation of a unique library of T-lymphocytes & other datasets post-vaccination with its personalized immunotherapeutic vaccines to utilize predictive algorithms and other technologies to identify new targetable tumor antigens. BioVaxys common shares are listed on the CSE under the stock symbol “BIOV” and trade on the Frankfurt Bourse (FRA: 5LB) and in the US (OTCQB: BVAXF). For more information, visit and connect with us on X and LinkedIn.


Signed “James Passin
James Passin, Chief Executive Officer
Phone: +1 646 452 7054

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